Failure analysis

The ARENIUS laboratory also offers failure analysis services by micrographic sectioning and SEM analysis (scanning electron microscope) in order to assist you in your investigations into failure quality issues (electromigration, cracks, delamination, whiskers, soldering shape, homogeneity of alloys, contamination, broken tracks, etc.).

A failure is a physical, chemical or mechanical phenomenon that no longer allows the component or equipment to perform its function. This damage can come from cracks, corrosion, wear, deformation, or variation in properties or appearance.

A failure analysis is always preceded by a study and information collection phase for a better understanding of the phenomenon; if necessary, an additional on site study can be carried out. This phase is very important for the direction of the analysis.

Observing the failure and studying the failure mechanism will allow designers to establish solutions and make improvements, which will improve quality and prevent the phenomenon from recurring.

Characterization of component defects
(crack, corrosion, short circuit, migration, etc.)
1
CMS componant crack
2
Cupper interface crack
1
2
1
Crack between granular
2
Delamination
1
2
Surface defects analyzes
(pollution, crack, etc.)
1
Nickel oxydation by black pad
1
Thickness measurement of
intermetallic layers on soldering
Alloy homogeneity control
EDX (Energy Dispersive X-ray Spectroscopy)
analysis on material composition
FTIR (Fourier Transform InfraRed)
and DCS (Differential Scanning Colorimetry)
for chemical and thermal analysis
SEM (Scanning Electronic Microscopy) observation
1
Stich bonding
2
Ball bonding
1
2
X ray analysis
Chemical opening of
microelectronic component
Whisker analysis according
to JEDEC 22-A121-01 standard