Thermal shocks testing

The purpose of thermal shock tests is to determine the ability of components, equipments or other products to withstand rapid changes in ambient temperature. They are very commonly carried out by manufacturers in the electronics sector in order to highlight the weaknesses of the processes. A micrographic and scanning electron microscope failure analysis can be performed in the event of a malfunction to determine the failure mode of the responsible component.

Video presentation essay

Temperature range: from -75°C to +180°C
Time transfer: <10s

Mobil part looseness
Component break or deformation
Cracks apparition
Insulation trouble apparition
Electronic components characteristics changes
Efficiency reducing of protective chemical agents
Electrical and mechanical trouble due to quick water or ice generation
Excessive static electricity

CEI 60068-2-14, MIL STD 810 method 503, MIL STD 883 method 1011, MIL STD 202 method 107, GAM EG 13 fascicule 7, RTCA DO 160 section 4, RTCA DO 160 section 5, AECTP method 304, B22 6310

Essais climatique : enceinte de choc thermique