Failure analysis

Our laboratory can intervene as part of your analyzes or investigations in order to determine the modes and mechanisms of component failure (contamination, corrosion, electro-migration, whiskers, weld failure, shape of brazing, homogeneity of alloys, breakage of tracks, etc.). We offer a wide range of non-destructive or destructive analysis services depending on the type of analysis and customer constraints.

  • Visual observation under binocular
  • Wettability analysis
  • Chemical decapsulation
  • Micrographic cut
  • Analysis of materials by EDX (Energy Dispersive X-ray Spectroscopy)
  • SEM observation (Scanning Electron Microscope) – Measurement of layer thicknesses

As part as your analyses or investigations in order to establish failure mechanisms and modes (contamination, corrosion, electro-migration, whiskers, soldering failures…) we realize non destructive or destructive analysis according to your requirements.
– Binocular observation
– Wetting analysis
– Chemical package opening
– Micro sectioning
– EDX material analysis (energy-dispersive X-ray spectroscopy)
– SEM observation (Scanning Electron Microscopy)
– Layer and inter-metallic thicknesses measurements

Coupe micrographique, analyse MEB et EDX